包邮集成电路封装材料的表征

foreword xi
preface to the reissue of the materials characterization series xiii
preface to series xiv
preface to the reissue of integrated circuit packaging materials xv
preface xvi
contributors xix
ic package reliability testing
mold compound adhesion and strength
mechanical stress in ic packages
moisture sensitmty and delamination
thermal management
electrical performance of ic packages
solderability of integrated circuits
hermeticity and joining in ceramic ic packages
advanced interconnect technology
appendix： technique summaries