超摩尔时代电子封装建模分析设计与测试(英文版)(精)/先进电子封装技术与关键材料丛书

Preface vii

Acknowledgments xi

About the authors xiii

1Introduction 1
1.1Evolution of integrated circuit packaging 1
1.2Performance and design methodology for integrated circuit packaging 6
References 11
Further reading 12

2Electrical modeling and design 13
2.1Fundamental theory13
2.2Modeling, characterization, and design of through-silicon via packages 28
References 53

3Thermal modeling, analysis, and design 59
3.1Principles of thermal analysis and design 59
3.2Package-level thermal analysis and design 74
3.3Numerical modeling 89
3.4Package-level thermal enhancement 97
3.5Air cooling for electronic devices with vapor chamber configurations 101
3.6Liquid cooling for electronic devices 106
3.7Thermoelectric cooling 112
References 126

4Stress and reliability analysis for interconnects 131
4.1Fundamental of mechanical properties 131
4.2Reliability test and analysis methods 149
4.3Case study of design-for-reliability 227
References 239

5Reliability and failure analysis of encapsulated packages 245
5.1Typical integrated circuit packaging failure modes 245
5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245
5.3Thermal- and moisture-induced stress analysis 263
5.4Fracture mechanics analysis in integrated circuits package 270
5.5Reliability enhancement in PBGA package 282
References 290
Further reading 292

6Thermal and mechanical tests for packages and materials 293
6.1Package them叫tests 293
6.2Material mechanical test and characterization 306
References 322

7System-level modeling, analysis, and design 325
7.1System-level them叫modeling and design 325
7.2Mechanical modeling and design for microcooler system 348
7.3Codesign modeling and analysis for advanced packages 370
References 389

Appendix 1 Nomenclature 393

Appendix 2 Conversion factors 403

Index 405