涂层薄膜应力及其纳米压痕检测(英文)

Contents1 Residual Stresses of Materials 11.1 Definition and Classification of Residual Stresses 11.2 Formation Mechanism of Residual Stress 21.2.1 Formation Mechanism of Macroscopic Residual Stress 21.2.2 Formation Mechanism of Microscopic Residual Stress 31.3 Effect of Residual Stress on Properties of Materials 31.3.1 Effect of Residual Stress on Fatigue Strength 31.3.2 Effect of Residual Stress on Brittle Failure 41.3.3 Effect of Residual Stress on Stress Corrosion Cracking 51.3.4 Effect of Residual Stress on Machining Precision and Dimension Stability 61.4 Test Methods of Residual Stress 71.4.1 Nondestructive Testing Methods 71.4.2 Destructive Testing Methods 13References 172 Principle and Methods of Nanoindentation Test 212.1 Overview of Nanoindentation Technique 212.2 Measurement Principles of Hardness and Elastic Modulus 222.2.1 Oliver and Pharr Method (O&P Method) 222.2.2 Work-of-Indentation Method 252.2.3 Continuous Stiffness Measurement 272.3 Nanoindentation Testing Method 282.3.1 Indenter Types 282.3.2 Nanoindentation Instrumentation 302.4 Factors Affecting Nanoindentation Test Results 353 Theoretical Models for Measuring Residual Stress by Nanoindentation Method 373.1 Principle of Measuring Residual Stress by Nanoindentation Method 373.2 Effect of Residual Stress on Nanoindentation Parameters 373.2.1 Effect of Residual Stress on Load-Depth Curves 393.2.2 Effect of Residual Stress on Pile-up Deformation 423.2.3 Effect of Residual Stress on Contact Area 473.2.4 Effect of Residual Stress on Mechanical Properties 483.3 Models for Measuring Residual Stress 493.3.1 Suresh Model 513.3.2 Lee Model 593.3.3 Xu Model 623.3.4 Swadener Model 633.4 Indentation Fracture Technique 65References 664 Application of Suresh and Lee Models in the Measurement of Residual Stress of Bulk Materials 694.1 Measurement of Residual Stresses in Single Crystal Copper 694.1.1 Pile-up of Single Crystal Copper 694.1.2 Model Construction of the Real Contact Area 704.1.3 Comparison of Different Methods for Calculating Contact Area 734.1.4 The Real Contact Area of the Single Crystal Copper 754.1.5 The Real Hardness of the Single Crystal Copper 764.1.6 Residual Stress Calculation of the Single Crystal Copper 784.2 Residual Stress Determination of 1045 Steel 794.2.1 Experimental 794.2.2 Load-Depth Curves of the 1045 Steel 804.2.3 Pile-up Deformation of the 1045 Steel 804.2.4 The Real Hardness of the 1045 Steel 834.2.5 Calculation of Residual Stresses of the 1045 Steel 87References 975 Application of Suresh and Lee Models in the Measurement of Residual Stress of Coatings 995.1 Residual Stresses of Fe-Based Laser Cladding Coatings 995.1.1 Preparation of Fe-Based Laser Cladding Coatings 995.1.2 Microstructures of Fe-Based Laser Cladding Coatings 1015.1.3 Residual Stress Analysis of Fe-Based Laser Cladding Coatings 1055.2 Residual Stress of Fe-Based Coatings Prepared by Supersonic Plasma Spraying 1145.2.1 Preparation of Sprayed Fe-Based Coatings 1145.2.2 Microstructure of Sprayed Fe-Based Coatings 1155.2.3 Residual Stress Analysis of Sprayed Fe-Based Coatings 1195.3 Residual Stress of Plasma Cladding Coatings 1295.3.1 Preparation of Plasma Cladding Coatings 1295.3.2 Microstructure of Plasma Cladding Coatings 1305.3.3 Mechanical Properties of Plasma Cladding Coatings 1325.3.4 Residual Stress Analysis of Plasma Cladding Coatings . 1345.4 Residual Stress of n-Al203/Ni Composite Brush Plating Coatings 1385.4.1 Preparation of n-A^C^/Ni Composite Brush Plating Coatings 1395.4.2 Microstructure of n-Al203/Ni Composite Brush Plating Coatings 1395.4.3 Mechanical Properties of n-Al203/Ni Composite Brush Plating Coatings 1415.4.4 Residual Stress Analysis of n-Al203/Ni Composite Brush Plating Coatings 143References 1456 Application of Suresh and Lee Models in the Measurement of Residual Stress of Films 1476.1 Residual Stress of Magnetron Sputtering Cu Films 1476.1.1 Preparation of Magnetron Sputtering Cu Films 1476.1.2 Microstructure of Magnetron Sputtering Cu Films 1486.1.3 Mechanical Properties of Magnetron Sputtering Cu Films 1526.1.4 Residual Stress Analysis of Magnetron Sputtering Cu Films 1526.2 Residual Stress of Magnetron Sputtering Ti Films 1566.2.1 Preparation and Characterization of Magnetron Sputtering Ti Films 1566.2.2 Effects of Process Parameters on the Hardness and Elastic Modulus of Ti Films 1666.2.3 Effect of Process Parameters on the Residual Stress of Ti Films 1726.3 Residual Stress of TiN Films and Ti/TiN Multilayer Films 1786.3.1 Preparation and Characterization of TiN Films 1786.3.2 Preparation and Characterization of Ti/TiN Multilayer Films 1816.3.3 Hardness and Elastic Modulus of T