Professional English for Microelectronics(微电子专业英语)

PART I Basic knowledge of semiconductor physics and semiconductor devices Chapter 1 Semiconductor 1.1 Early history of semiconductors 1.2 Properties and materials of semiconductor 1.3 Band theory of solids 1.4 Charge carrier (electrons and holes) 1.4.1 The carrier concentration 1.4.2 Carrier generation and recombination 1.4.3 Drift and diffusion current 1.5 Electrical conduction 1.6 Doping of semiconductor 1.7 Type of semiconductor 1.7.1 N-type semiconductor 1.7.2 P-type semiconductor 1.8 Questions 1.9 References Chapter 2 Semiconductor devices 2.1 PN junction 2.1.1 Basic structure of the PN junction 2.1.2 Unbiased PN junction 2.1.3 The current-voltage characteristic of PN junction 2.1.4 The breakdown of PN junction 2.1.5 Junction capacitance 2.1.6 The applications of PN junction 2.2 Schottky diode 2.2.1 The structure of Schottky diode 2.2.2 The principle of Schottky diode 2.2.3 The characteristics of Schottky diode 2.2.4 The applications of Schottky diode 2.3 Heterojunction diode 2.3.1 The concept of heterojunction 2.3.2 The characteristics of heterojunction diode 2.3.3 The application of heterojunction diode 2.4 Bipolar junction transistor(BJT) 2.4.1 The basic structure of BJT 2.4.2 The current transfer characteristic of transistor 2.4.3 Basic configurations and modes of operation 2.4.4 The application of transistor 2.5 The MOS transistor 2.5.1 The basic structure of MOS transistor 2.5.2 The form of inversion layer of MOSFET 2.5.3 The basic operation and DC characteristic of MOSFET 2.5.4 The types of MOSFET 2.5.5 The terminal capacitances of MOSFET 2.5.6 The advantage and application of MOSFET 2.6 Questions 2.7 References PART II Manufacturing technologies and processes Chapter 3 Doping technology and hot processing 3.1 Doping 3.1.1 Diffusion 3.1.2 Ion implantation 3.1.3 Idealized ion implantation systems 3.1.4 Channeling effects 3.1.5 Shadowing effects 3.1.6 Ion implantation damage 3.2 Thermal oxidation 3.3 Rapid thermal proeessing(RTP) 3.3.1 RTP configuration and chamber design 3.3.2 Rapid thermal activation of impurities 3.3.3 Rapid thermal processing of dielectrics 3.4 Questions 3.5 References Chapter 4 Pattern transfer 4.1 Photolithography 4.2 Photoresist (PR) 4.2.1 Composition of PR 4.2.2 The types of PR 4.2.3 The contrast curve of PR 4.3 The pre-exposure process 4.3.1 Priming 4.3.2 Photoresist coating 4.3.3 Soft bake 4.4 Alignment and exposure 4.4.1 Printer 4.4.2 Photomask fabrication 4.4.3 Alignment 4.4.4 Exposure 4.5 Postexposure 4.5.1 Postexposure bake 4.5.2 Development 4.5.3 Hard bake 4.5.4 Pattern inspection 4.6 Nonoptical lithographic techniques 4.6.1 X-ray lithography (XRL) 4.6.2 Projection X-ray lithography 4.6.3 Electron beam lithography (EBL) 4.6.4 Projection electron beam lithography (SCALPEL) 4.6.5 Ion beam lithography 4.6.6 EBL and XRL resist 4.7 Etch 4.7.1 Introduction 4.7.2 The characteristic of etch 4.7.3 Wet etch process 4.7.4 Chemical mechanical polishing (CMP) 4.7.5 Dry etching 4.8 High density plasma (HDP) etching 4.9 Liftoff 4.10 Questions 4.11 References Chapter 5 Thin film 5.1 The introduction of thin film 5.1.1 Metallic thin films 5.1.2 Polysilicon 5.1.3 Oxide and nitride thin films 5.2 Physical vapor deposition 5.2.1 Evaporation 5.2.2 Sputter 5.3 Chemical vapor deposition 5.3. 1 Chemical vapor deposition process description 5.3.2 Classification of CVD reactors 5.3.3 Atmospheric pressure CVD 5.3.4 Low pressure CVD in hot wall systems 5.3.5 Plasma-enhanced CVD 5.3.6 Step coverage 5.4 Epitaxial growth 5.4.1 Homoepitaxy 5.4.2 Vapor phase epitaxy 5.4.3 VPE hardware 5.4.4 Epitaxy process 5.4.5 Selective epitaxial growth 5.4.6 Heteroepitaxy 5.4.7 MBE 5.4.8 MOCVD 5.5 Questions 5.6 References Chapter 6 Process Integration 6.1 CMOS 6.1.1 Introduction 6.1.2 The formation of the CMOS process 6.2 Microelectromechanical system (MEMS) 6.2.1 Introduction 6.2.2 The types and advantages of MEMS 6.2.3 The processes of MEMS 6.3 Nanoelectromechanical system (NEMS) 6.4 Questions 6.5 References PART III Frontiers of science and technology Chapter 7 More than Moore:creating high value micro/ nanoelectronics systems 7.1 Introduction 7.2 Preconditions for an industry-wide technical roadmap 7.3 Lessons learned from "More Moore" 7.3.1 Metallic nanowires 7.3.2 Combining focus and variety 7.4 Proposed methodology for "More-than-Moore" 7.5 Applying the proposed methodology 7.5.1 Form societal needs to markets 7.5.2 MtM devices 7.6 Summary 7.7 References PART IV Development of professional English ability Chapter 8 How to write a scientific paper 8.1 What is a scientific paper 8.1.1 The structure of a paper 8.1.2 Steps for writing a paper 8.2 Searching information in databases 8.2.1 Web of Science 8.2.2 Google Scholar 8.3 How to prepare the Title 8.4 How to prepare the abstract 8.5 How to write the Introduction 8.6 How to write the Materials and Methods section 8.7 How to write the Results 8.8 How to write the Discussion 8.9 How to state the Acknowledgment 8.10 How to cite the Reference 8.11 Questions 8.12 References Chapter 9 How to make a successful presentation 9.1 Attention curve 9.2 How to make a great PowerPoint presentation 9.2.1 Create your narrative 9.2.2 Utilize the format 9.3 How to prepare an oral presentation 9.3.1 Before your presentation 9.3.2 During your presentation 9.3.3 Warnings for oral presentation 9.4 Questions 9.5 References